- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/386 - Removing material by boring or cutting by boring of blind holes
Patent holdings for IPC class B23K 26/386
Total number of patents in this class: 58
10-year publication summary
3
|
16
|
10
|
4
|
8
|
5
|
6
|
6
|
6
|
1
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Omron Corporation | 6968 |
10 |
Corning Incorporated | 9932 |
6 |
Skyworks Solutions, Inc. | 3450 |
5 |
Rtx Corporation | 8674 |
3 |
Applied Materials, Inc. | 16587 |
2 |
Disco Corporation | 1745 |
2 |
Eissmann Automotive Deutschland GmbH | 32 |
2 |
Electro Scientific Industries, Inc. | 416 |
2 |
Mitsui Mining & Smelting Co., Ltd. | 1373 |
2 |
Samsung Electronics Co., Ltd. | 131630 |
1 |
Samsung Display Co., Ltd. | 30585 |
1 |
The Boeing Company | 19843 |
1 |
Infineon Technologies AG | 8189 |
1 |
Mitsubishi Electric Corporation | 43934 |
1 |
Boston Scientific Scimed, Inc. | 8794 |
1 |
Murata Manufacturing Co., Ltd. | 22355 |
1 |
Kyocera Corporation | 12735 |
1 |
IPG Photonics Corporation | 494 |
1 |
M-solv Ltd. | 46 |
1 |
Nippon Electric Glass Co., Ltd. | 2299 |
1 |
Other owners | 13 |